1. Epoxy Resin Potting Glue
• Characteristics: After hardening, epoxy resin potting glue forms a hard protective layer with good mechanical strength, chemical corrosion resistance and electrical insulation.
• Application: Widely used in electronic components and circuit boards that require high-strength protection, such as transformers, inductors, power modules, etc.
• Disadvantages: It is brittle after hardening and may crack under stress, which is not suitable for applications that require a certain degree of flexibility.
2. Polyurethane Potting Glue
• Characteristics: After hardening, polyurethane potting glue has good flexibility and elasticity, which is suitable for applications that need to absorb vibration and impact, and also has good weather resistance and anti-aging properties.
• Application: Suitable for automotive electronics, sensors, LED drive power supplies and other fields that require high impact resistance and flexibility.
• Disadvantages: Heat resistance and chemical corrosion resistance are slightly worse than epoxy resin.
3. Silicone Potting Glue
• Characteristics: Silicone potting glue has excellent high and low temperature resistance (generally stable in the range of -60℃ to 200℃), good electrical insulation and weather resistance, and also has a certain degree of flexibility.
• Application: Widely used in electronic devices that are sensitive to temperature changes, such as solar panels, LEDs, sensors and communication equipment.
• Disadvantages: Slow curing speed, average mechanical strength and adhesion.
4. Acrylic Potting Glue
• Characteristics: Acrylic potting glue has a fast curing speed, is easy to use, and has good adhesion, UV resistance, and weather resistance.
• Application: Suitable for potting of outdoor electronic components, such as communication equipment, power equipment, etc.
• Disadvantages: Heat resistance and chemical resistance are not as good as epoxy resin and silicone glue.
5. Polyamide Potting Glue
• Characteristics: It has excellent impact resistance and adhesion, smooth surface after curing, good wear resistance and chemical corrosion resistance.
• Application: Used in cable connectors, electronic components, sensors and other fields, especially in environments that require oil resistance and solvent resistance.
• Disadvantages: Average temperature resistance, cannot withstand high temperatures for a long time.
6. UV Light Curing Potting Glue
• Characteristics: Rapid curing by ultraviolet irradiation, easy to use, suitable for high-efficiency production line operation, with high transparency and low shrinkage.
• Application: Suitable for the protection of small electronic compoents, such as LCD displays, microelectronic components, etc.
• Disadvantages: Curing requires a special UV light source, and it is difficult to cure the shadow area.
7. Two-component Potting Glue
• Characteristics: Two-component potting glue is a chemical reaction curing after mixing twocomponents, and usually has good mechanical properties, chemical resistance and electrical insulation.
• Application: Used for electronic components that require high strength, impact resistance and weather resistance, such as high-power LEDs, power modules, etc.
• Disadvantages: An accurate mixing ratio is required, and mixing equipment must be prepared before use.