Hot Melt Glue
Definition: Hot melt glue is an adhesive that forms a bond on the surface of the substrate after being heated and melted. It will solidify quickly after cooling to form a strong bonding effect. Hot melt glue usually needs to be heated to a certain temperature (usually between 150℃ and 200℃) by hot melt guns, coating machines and other equipment, and then applied to the surface of the substrate. The bonding is completed after the colloid cools down.
Features: It needs to be heated to melt and cooled to solidify. It usually has a high bonding strength, but is sensitive to temperature and pressure.
Hot Melt Pressure Sensitive Adhesive
Definition: Hot melt pressure sensitive adhesive is an adhesive that can be bonded at room temperature and does not require an external heat source to melt. Its bonding is achieved by applying pressure. This adhesive maintains a certain viscosity at room temperature and can be bonded to the substrate with slight pressure. It is usually used in tapes, labels, stickers and other fields.
Features: It can be bonded at room temperature, with only slight pressure, and no heating or cooling is required.
1. Bond Strength
The bond strength of hot melt glue is usually high, suitable for applications requiring strong bonding.
2. Temperature Resistance
Affected by temperature, high temperature may cause softening, low temperature may cause brittleness.
3. Durability
The adhesive layer formed after cooling is relatively strong and has good durability.
1. Bond Strength
Usually low, mainly bonded by small pressure, suitable for scenes that need to be removable or respositionable.
2. Temperature Resistance
Generally not resistant to high temperatures, but heat resistance can be improved through special formulas.
3. Durability
Suitable for short-term bonding, the bonding effect may change with time and external forces.